Detail TIMAH SOLDER PASTA TIMAH CAIR 500 GRAM
Timah solder pasta anti kering
- Hasil Cetak IC padat dan tidak kotor
- Bubuk timah yg sangat halus 20-38um
- Anti kering
1.Low temperature No Clean Solder Paste
.Alloy : Sn42Bi58
Mesh : 20-38 um
138° C
2. Medium temperature No Clean Solder
- Alloy : Sn63Pb37
- Mesh : 20-38 um
183°-210° C
Menyediakan paket Hemat
- 15 Gram
- 20 Gram
- 30 Gram
- 35 Gram
- 50 Gram
- Spuit 3ml/ 16 Gram
- Spuit 5ml/ 25 Gram
Khusus Netto 500 GramKetersediaan stok confirm dulu ya bosskuh
Gambar produk