Detail TIMAH CAIR ANTI KERING LOW TEMPERATURE 30 Gram
NO CLEAN SOLDER PASTE 138° LOW TEMPERATURE (mudah cair dibawah 200° C. menjaga IC, Mesin yg rentan rusak jika proses soldering terlalu lama)
Mesh (ukuran debu timah) : 20-38 um
Netto : 30 Gram (isi timah 25 Gram)
Ready Banyak kakak
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TIMAH CAIR ANTI KERING LOW TEMPERATURE 30 GramTIMAH CAIR ANTI KERING LOW TEMPERATURE 30 GramTIMAH CAIR ANTI KERING LOW TEMPERATURE 30 GramTIMAH CAIR ANTI KERING LOW TEMPERATURE 30 Gram