Detail (UMU SUPPLIER) THERMAL PAD 1CM x 1CM x 0.5MM ISI 100 PCS CHIPSET VRAM VGA HEATSINK
DISARANKAN MENAMBAH BUBBLE WRAP UNTUK PACKING LEBIH AMAN https://shopee.co.id/BUBBLE-WRAP-packing-kardus-i.27241445.5232788013?sp_atk=41b3154b-2329-49a4-92f3-520742f2ba86&xptdk=41b3154b-2329-49a4-92f3-520742f2ba86
Soft and easy to apply. Low viscosity, High thermal conductivity rate. Can be cut to any desired size. Very good malleability. Not electric conductive to prevent any electronic damage.