Detail Thermal cooling pad 100x100x3 mm CPU CHIPSET IC HEATSINK termal 3mm 3
Thermal cooling pad 100x100x3 mm CPU CHIPSET IC HEATSINK termal 3mm 3
harpa per 1pcs
Features: EFFICIENT THERMAL CONDUCTIVITY: The Thermal Pad based on silicone & a special filler outperforms generic and performance pads by far. The Thermal Conductivity amounts to 3.5 W/mK. FILLING THE GAPS: Due to its low hardness and great compressibility, the thermal pad works as the perfect gap filler and bridges uneven surface and gaps without any problems. SAFE HANDLING: The Pad doesn’t contain metallic particles, is electrically isolating & not capacitive. A contact with any electrical traces wouldn’t result in damage of any sort. Safe & easy handling. EASY & FAST TO APPLY: Installing the Thermal Pad is child's play & perfect for beginners. The ideal high performance gap filler! Electrically non-conductive. High thermal conductivity rate; Soft and tacky. easy to apply. Maximum heat conduction and increased cooling. It can be cut to any desired size. Reduce the effectiveness of your heatsink and raise the operating temperature of your processor/video card. With this pad to greatly lower gpu temperatures, can be used for graphics, northbridge,memory chipset,IC chips. Parameters: Size: 100x100mm Thickness:0.5/1/1.5/2/2.5/3/4/5mm Color: Blue Material: Conduction silicone Continuous Temp: -40 Degrees-260 Degrees Thermal Conductivity: 3.5w/m-K Breakdown Voltage: 4kv/m