Supergoodsales Tin Mesh Solder Template BGA Reballing Stencil Compact Appearance Multifunctional Fast Tinning Speed for Phone IC Chips
Deskripsi singkat
Elektronik > Kelistrikan > Kelistrikan Lainnya > Supergoodsales Tin Mesh Solder Template BGA Reballing Stencil Compact Appearance Multifunctional Fast Tinning Speed for Phone IC Chips
- Pengiriman Ekspres
- Barang yang diperiksa
- Bayar di tempat berlaku
- Kualitas, Prestise
- Pengembalian produk
- Dukung pembuatan faktur
Produk Terkait
Detail Supergoodsales Tin Mesh Solder Template BGA Reballing Stencil Compact Appearance Multifunctional Fast Tinning Speed for Phone IC Chips
--------------☀Welcome to Supergoodsales☀-------------✔Good Quality✔Available✔Lowest Price
✈Shipping from oversea,items will arrive your home in 1-2 week.
⏩If you follow us and screenshot to us, you will have a free gift.
❀Please Enjoy Your Shopping Time↖(^ω^)↗
1. FOUR PITCHES: Universal BGA reballing stencil has three types of holes with 0.3 0.35 0.4 0.5 pitch, four kinds of spacing and multiple sizes.
2. PRECISE POSITIONING: Tin mesh solder template is precisely positioned for fast tin implantation, and the ball template will not change under high temperature.
3. COMPACT APPEARANCE: Universal BGA reballing stencil has a compact appearance and is easy to carry around and use.
4. VERSATILE: BGA reballing stencil is versatile and suitable for the common IC used in cell phones today, which can meet your various needs.
5. STAINLESS STEEL MATERIAL: Tin mesh solder template is made of premium stainless steel material, which is not easily damaged and has a long service life.
Specification:
Item Type: BGA Reballing Stencil
Pitch: 0.3mm/0.012in, 0.35mm/0.014in, 0.4/0.016in, 0.5mm/0.020in
Product Material: Stainless Steel
Package List:
1 x
BGA Reballing Stencil
Gambar produk
