Quick Solder Uap / Blower Uap / Hot Air BGA SMD Rework Station 850A

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Detail Quick Solder Uap / Blower Uap / Hot Air BGA SMD Rework Station 850A

ITEM Best price Quick 850A hot air bga smd rework station
Brand Quick
Power Consumption 270W
Temperature Range 100℃~420℃
size 33.5*27.5*19cm
weight 4.1kg
OEM yes

1 original Quick smd rework
2 constant temperature
3 high stability, long using life.

Function:
1. Prevent static electric and creepage to damage the PCB.
2. Don’t need to touch the PCB, which can avoid element moving and heating impaction.
3. Extensively adjust airflow and temperature and select different nozzles, so it can fit most of SMD.
4. Use inlet heating element, the type of heating element and nozzle is same as the international.
5. Delay to blow cool airflow when turn the power switch off, it can protect the unit.

Applications:
1. Fits most of SMD, Such as SOIC, CHIP, QFP, PLCC, BGA etc.
2. Contract hose.