Detail PLAT BGA ORI AMAOE QUALCOMM MQ1 MQ2 MQ3 MQ4
PLAT BGA ORI AMAOE JAPAN Reballing Stensil 0.12mm
BAHAN STENSIL HIGH QUALITY
PLAT BGA MQ1 = SDM845 SDM710 SDM660 MT6757V MT6763V MT6771V MT6739V IC Chip
PLAT BGA MQ2 = MTK MT6761V MT6779V MT6758V SDM439 MT6765V MT6768V MSM8909W RAM CPU
PLAT BGA MQ3 = MTK SM7250 SM7150 SM6125 SM8250 RAM MT6885Z RAM MT6885Z Snapdragon 865 CPU
PLAT BGA MQ4= SM8350 SM8450 SM7315 SM7325 MT6833V MT6799W MT6877V
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