Detail PLAT BGA ORI AMAOE QUALCOMM MQ1 MQ2 MQ3 MQ4
PLAT BGA ORI AMAOE JAPAN Reballing Stensil 0.12mm
BAHAN STENSIL HIGH QUALITY
PLAT BGA MQ1 = SDM845 SDM710 SDM660 MT6757V MT6763V MT6771V MT6739V IC Chip
PLAT BGA MQ2 = MTK MT6761V MT6779V MT6758V SDM439 MT6765V MT6768V MSM8909W RAM CPU
PLAT BGA MQ3 = MTK SM7250 SM7150 SM6125 SM8250 RAM MT6885Z RAM MT6885Z Snapdragon 865 CPU
PLAT BGA MQ4= SM8350 SM8450 SM7315 SM7325 MT6833V MT6799W MT6877V
Gambar produk
PLAT BGA ORI AMAOE QUALCOMM MQ1 MQ2 MQ3 MQ4
PLAT BGA ORI AMAOE QUALCOMM MQ1 MQ2 MQ3 MQ4
PLAT BGA ORI AMAOE QUALCOMM MQ1 MQ2 MQ3 MQ4
PLAT BGA ORI AMAOE QUALCOMM MQ1 MQ2 MQ3 MQ4