Specifications : 1. Primary Use : Thermal Coupling of electrical / electronic devices to heatsinks 2. Special Properties : High Conductivity; low bleed. Stable at high temperatures. 3. Type : Silicon fluid 4. Physical form : Grease-like 5. Thermal Conductivity : > 1 W/mk-k 6. Thermal Impedance : < 0,211 Celcius - in 2 W