Detail Papan Power Expansion Controller Tegangan Tinggi Untuk Printer 3D
Description: Heated bed power module Based on powerful MOSFET HA210NO6 Size: 59*48mm Mounting holes: 3.2mm diameter, for M3 screws. Distance betweeen holes: 54*43mm Very powerful MOSFET to withstand higher current than normal RAMPS or other 3D Printer controller can handle Voltage: 12V-24V Maximum current with active cooling: 210A This module is based on power MOSFET and will allow PID control of the heated bed (DC-DC Relays usually do not allow this) Under the premise of normal cooling, it work stable under I(Max)=2, the current must not exceed 2 while the process working Package Includes: 1 x Heated Bed Power Module 1 x Connection cable for input signal
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