Papan Power Expansion Controller Tegangan Tinggi Untuk Printer 3D

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Detail Papan Power Expansion Controller Tegangan Tinggi Untuk Printer 3D

Description:
Heated bed power module
Based on powerful MOSFET HA210NO6
Size: 59*48mm
Mounting holes: 3.2mm diameter, for M3 screws.
Distance betweeen holes: 54*43mm
Very powerful MOSFET to withstand higher current than normal RAMPS or other 3D Printer controller can handle
Voltage: 12V-24V
Maximum current with active cooling: 210A
This module is based on power MOSFET and will allow PID control of the heated bed (DC-DC Relays usually do not allow this)
Under the premise of normal cooling, it work stable under I(Max)=2, the current must not exceed 2 while the process working
Package Includes:
1 x Heated Bed Power Module
1 x Connection cable for input signal