Mainboard motherboard mobo LGA 1155 H61 OEM + FAN

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Detail Mainboard motherboard mobo LGA 1155 H61 OEM + FAN

Mainboard motherboard mobo LGA 1155 H61 SAMSUNG Q67S1 GEN2/GEN3

SPESIFIKASI :

CPU SUPPORT
Intel® Core™ i7 LGA 1155 Processor
Intel® Core™ i5 LGA 1155 Processor
Intel® Core™ i3 LGA 1155 Processor
Intel® Pentium® LGA 1155 Processor
Maximum CPU TDP (Thermal Design Power) : 95Watt

MEMORY
Support Dual Channel DDR3 1066/1333/1600 MHz
2 x DDR3 DIMM Memory Slot
Max. Supports up to 16GB Memory

Slot ekspansi
1xPCI Expressx16
2xPCI Expressx1
1xPCI

LAN
Realtek® ALC662, 1 x Gigabit LAN Controller(s)


GARANSI 2 MINGGU SETELAH BARANG DITERIMA

packing aman mengguakan bubblewarp
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Mainboard motherboard mobo LGA 1155 H61 OEM + FAN
Mainboard motherboard mobo LGA 1155 H61 OEM + FAN
Mainboard motherboard mobo LGA 1155 H61 OEM + FAN
Mainboard motherboard mobo LGA 1155 H61 OEM + FAN
Mainboard motherboard mobo LGA 1155 H61 OEM + FAN
Mainboard motherboard mobo LGA 1155 H61 OEM + FAN
Mainboard motherboard mobo LGA 1155 H61 OEM + FAN
Mainboard motherboard mobo LGA 1155 H61 OEM + FAN
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