Extra bubble wrap dan packing kayu untuk keamanan paket agan agar barang lebih aman pada saat proses pengiriman (REKOMENDASI) - Packing Kayu https://seller.shopee.co.id/portal/product/8001513386/ - Extra Bubble Wrap https://seller.shopee.co.id/portal/product/5241237073/
SPECIFICATION :
CPU 1. AMD Socket AM4, support for: 3rd Generation AMD Ryzen™ processors/ 3rd Generation AMD Ryzen™ with Radeon™ Graphics processors
Chipset 1. AMD B550
Memory 1. 4 x DDR4 DIMM sockets supporting up to 128 GB (32 GB single DIMM capacity) of system memory 2. 3rd Gen AMD Ryzen™ Processors: Support for DDR4 4000(O.C.) / 3600(O.C.) / 3333(O.C.) /3200/2933/2667/2400/2133 MHz memory modules 3. New Generation AMD Ryzen™ with Radeon™ Graphics processors: Support for DDR4 4733(O.C.) / 4600(O.C.) / 4400(O.C.) / 4000(O.C.) / 3600(O.C.) / 3333(O.C.) /3200/2933/2667/2400/2133 MHz memory modules
Expansion Slots 1 x PCI Express x16 slot (PCIEX16), integrated in the CPU: 1. 3rd Generation AMD Ryzen™ processors support PCIe 4.0 x16 mode 2. 3rd Generation AMD Ryzen™ with Radeon™ Graphics processors support PCIe 3.0 x16 mode 1 x PCI Express x16 slot (PCIEX2), integrated in the Chipset: 3 x PCI Express x1 slots (PCIEX1_1, PCIEX1_2, PCIEX1_3), integrated in the Chipset:
Storage Interface 1 x M.2 connector (M2A_CPU), integrated in the CPU, supporting Socket 3, M key, type 2242/2260/2280/22110 SSDs: 1 x M.2 connector (M2B_SB), integrated in the Chipset, supporting Socket 3, M key, type 2242/2260/2280/22110 SSDs: 4 x SATA 6Gb/s connectors, integrated in the Chipset:
Operating System 1. Support for Windows 10 64-bit
Form Factor 1. ATX Form Factor; 30.5cm x 24.4cm
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