AMD B550 AORUS Motherboard with Direct 16 Phases Digital VRM, Fins-Array Heatsink, Direct-Touch Heatpipe, Thermal Backplate, Triple PCIe 4.0 x4 M.2 Direct from CPU, Intel® WiFi 6 802.11ax, 2.5GbE LAN, RGB FUSION 2.0, Q-Flash Plus
SPESIFIKASI • CPU 1. AMD Socket AM4, support for: 3rd Generation AMD Ryzen™ processors/ New Generation AMD Ryzen™ with Radeon™ Graphics processors (Please refer "CPU Support List" for more information.) • Chipset 1. AMD B550 • Memory 1. 4 x DDR4 DIMM sockets supporting up to 128 GB (32 GB single DIMM capacity) of system memory 2. 3rd Gen AMD Ryzen™ Processors: Support for DDR4 5200(O.C.) / 5000(O.C.) / 4866(O.C.) / 4600(O.C.) / 4400(O.C.) / 4000(O.C.) / 3600(O.C.) / 3333(O.C.) /3200/2933/2667/2400/2133 MHz memory modules 3. New Generation AMD Ryzen™ with Radeon™ Graphics processors: Support for DDR4 5400(O.C.) / 5200(O.C.) / 5000(O.C.) / 4866(O.C.) / 4600(O.C.) / 4400(O.C.) / 4000(O.C.) / 3600(O.C.) / 3333(O.C.) /3200/2933/2667/2400/2133 MHz memory modules 4. Dual channel memory architecture 5. Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules 6. Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules 7. Support for Extreme Memory Profile (XMP) memory modules (Please refer "Memory Support List" for more information.) • Onboard Graphics Integrated in the New Generation AMD Ryzen™ with Radeon™ Graphics processors: 1. 1 x HDMI port, supporting a maximum resolution of 4096x2160@60 Hz * Support for HDMI 2.1 version, HDCP 2.3, and HDR. Maximum shared memory of 16 GB • LAN 1. Realtek® 2.5GbE LAN chip (2.5 Gbit/1 Gbit/100 Mbit) • Wireless Communication module Intel® Wi-Fi 6 AX200 1. WIFI a, b, g, n, ac with wave 2 features, ax, supporting 2.4/5 GHz Dual-Band 2. BLUETOOTH 5 3. Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate * Actual data rate may vary depending on environment and equipment.