CRE 4PCS Universal BGA Stencil for MTK MSM Samsung Huawei Xiaomi iPad CPU RAM PM Power IC Reball Pin BGA Direct Heat Template

Detail CRE 4PCS Universal BGA Stencil for MTK MSM Samsung Huawei Xiaomi iPad CPU RAM PM Power IC Reball Pin BGA Direct Heat Template

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4PCS Universal BGA Stencil for MTK MSM Samsung Huawei Xiaomi iPad CPU RAM PM Power IC Reball Pin BGA Direct Heat Template
Description:
100% brand new and high quality.
Feature:
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.
BGA Reballing Stencil only, other accessories demo in the picture is not included!

Specifications:
Item Type: BGA Reballing Stencil
Material: Stainless Steel
Size: Standard Size
Color: Silver
Quantity: 4PCS

Note:
No retail package.
Transition: 1cm=10mm=0.39inch
Please allow 1-3mm error due to manual measurement. pls make sure you do not mind before you bid.
Due to the difference between different monitors, the picture may not reflect the actual color of the item. Thank you!

Package Includes:
4 x BGA Reballing Stencils

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